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Square black FBGA-676 chip with grid of solder balls underside

YINGHUA

YINGHUA XC6SLX150-2FGG676C FPGA semiconductor

SKU CH-53FE-6KC4N

Programmable gate array with 150k logic cells in a 676-ball FBGA package

  • Product typeICs Semicoductors
  • High-density logic with 150k gates
  • 676-ball FBGA package for compact PCB layouts
  • Spartan-6 architecture enables flexible reconfigurable designs
  • 2 speed grade delivers high-performance timing closure

XC6SLX150-2FGG676C FPGA for logic integration

The XC6SLX150-2FGG676C is a field-programmable gate array supplied in an FBGA-676 package. It provides reconfigurable logic resources for engineers implementing custom digital designs in communications, industrial control or signal-processing applications.

Thermal and power profile in typical operation

The device is specified with a -2 speed grade and 150 logic cells, which influence dynamic power consumption during active switching. Thermal performance depends on the board layout, airflow and the utilisation of the 676-ball FBGA footprint, so system integrators should characterise the design under realistic workloads.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $102.99
Pricier than about 80% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How is the FBGA-676 package soldered to the board, and what step causes the most defects?

The XC6SLX150-2FGG676C uses a 676-ball fine-pitch BGA footprint. The step most often done wrong is reflow profiling — insufficient soak time leaves voids under the centre balls, while excessive peak temperature warps the package substrate. Use a validated profile with X-ray inspection after the first pass.

What maintenance or replacement will this FPGA need during its service life?

The device itself has no moving parts or scheduled maintenance. Replacement only becomes necessary if the configuration bitstream is corrupted by voltage transients or if the 676 solder joints fatigue from repeated thermal cycling. Protect the supply rails and design the PCB for matched CTE to maximise lifetime.

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