YINGHUA XC6SLX150-3FGG900I FPGA Field Programmable Array FBGA-900 semiconductor
FPGA with 150K logic cells in a 900-ball FBGA package for custom hardware acceleration
- Product typeICs Semicoductors
- 150K logic cells enable complex designs
- 900-pin FBGA package supports dense integration
- Industrial temperature rating suits harsh environments
- Spartan-6 architecture balances performance and cost
XC6SLX150-3FGG900I FPGA for custom logic
The XC6SLX150-3FGG900I is a field-programmable gate array supplied in a 900-ball FBGA package. It provides reconfigurable logic resources for engineers developing custom digital circuits in communications, industrial control or signal-processing applications. The device is offered in new condition ready for prototype or production use.
Thermal and power behaviour in typical operation
Power draw and junction temperature depend on the implemented design, clock frequencies and I/O activity rather than a fixed specification. A properly sized heatsink and controlled airflow keep the package within its rated thermal envelope during continuous operation. Acoustic noise is determined by the system cooling solution, not by the FPGA itself.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $342.99
- Pricier than about 90% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
How is the FBGA-900 package mounted and what step is most often done wrong?
The 900-ball FBGA package requires reflow soldering onto a matching PCB footprint; the step most often done wrong is skipping the X-ray inspection that confirms every ball has reflowed correctly.
What maintenance or replacement will the XC6SLX150-3FGG900I need later?
The device itself has no moving parts or scheduled maintenance; replacement is only required if the FPGA is damaged by over-voltage, electrostatic discharge, or a board-level fault.
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