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Square FBGA-900 chip with dense ball grid array on dark substrate

YINGHUA

YINGHUA XC6SLX150-3FGG900I FPGA semiconductor

SKU CH-QVF3-TVJ5R

XC6SLX150-3FGG900I field-programmable gate array with 150K logic cells in a 900-ball FBGA package

  • Product typeICs Semicoductors
  • 150K logic cells for complex reconfigurable designs
  • 900-ball FBGA package enables high-density board integration
  • Industrial-grade silicon rated for extended temperature ranges
  • 3 speed grade delivers high-performance timing closure

YINGHUA XC6SLX150-3FGG900I FPGA overview

The YINGHUA XC6SLX150-3FGG900I is a field-programmable gate array supplied in an FBGA package with 900 pins. It provides 150 k logic cells for custom digital designs. Engineers use it for prototyping, signal processing and flexible I/O bridging in embedded systems. The device is shipped new and ready for board-level integration.

Suitable for logic-intensive prototyping

This FPGA suits developers who need reconfigurable logic with a high pin count in a single package. Teams requiring integrated transceivers, hard processor cores or a larger logic fabric should evaluate other device families. Designs that demand a smaller footprint or lower pin density may also prefer alternative packages.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $267.99
Pricier than about 89% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What JTAG programmer do I need to configure the XC6SLX150-3FGG900I?

A standard Xilinx Platform Cable USB or compatible third-party JTAG adapter that supports the FPGA's I/O voltage levels is required for programming.

Can I use this 900-ball FBGA device on a board designed for an older Spartan-6 part in a smaller package?

No, the 900-ball FBGA footprint is physically and electrically different from smaller Spartan-6 packages, so a dedicated PCB layout is required.

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