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Square black FBGA chip with 676 balls, XC6SLX150T model

YINGHUA

YINGHUA XC6SLX150T-3FGG676C FPGA semiconductor

SKU CH-X6WN-SX0RQ

Field-programmable gate array with 150 logic blocks in a 676-ball FBGA package

  • Product typeICs Semicoductors
  • 150K logic cells enable complex digital designs
  • 676-ball FBGA package suits dense PCB layouts
  • 3 speed grade meets high-frequency timing needs
  • New condition ensures full factory specification

XC6SLX150T FPGA for logic integration

The YINGHUA XC6SLX150T-3FGG676C is a field-programmable gate array built for engineers implementing custom digital logic. It suits prototyping, signal-processing pipelines and embedded control systems that demand reconfigurable hardware. The 676-ball FBGA package supports dense board layouts in professional development environments.

Upgrade from smaller Spartan-6 devices

Designs that exceed the logic capacity of lower-density Spartan-6 parts can move to this 150 k logic-cell device without changing the device family. The jump is worth it when a design needs more DSP slices, block RAM or I/O pins than smaller members provide. It does not suit projects that require the higher transceiver counts or logic density of larger FPGA families.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $381.99
Pricier than about 90% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What PCB footprint and pad count does the FBGA-676 package require?

The FPGA uses a 676-ball fine-pitch BGA footprint; design the board with matching 676 pads and the recommended land pattern for reliable soldering.

Which configuration interface and bitstream mode are used to program the device?

Program the XC6SLX150T via JTAG or SelectMAP using a compatible programmer; the common mistake is powering the core before the configuration bank voltages are stable.

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