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Small square chip with grid of solder balls underneath

YINGHUA

YINGHUA XC6SLX25T-2CSG324C FPGA-Field Programmable Array CSBGA-324 semiconductor

SKU CH-MQY2-9825P

A field-programmable gate array with 25 K logic cells in a 324-ball CSBGA package

  • Product typeICs Semicoductors
  • 25K logic cells for flexible digital design
  • 324-ball CSBGA package suits dense board layouts
  • Spartan-6 architecture balances cost and performance
  • 2 speed grade meets timing-critical applications

XC6SLX25T FPGA for logic design

The YINGHUA XC6SLX25T-2CSG324C is a field-programmable gate array supplied in a 324-ball chip-scale BGA package. It provides 25 thousand logic cells for custom digital circuitry. Engineers and students use it for prototyping, signal processing and embedded control applications.

Thermals and power in normal use

Power draw and thermal output vary with the programmed design, clock rates and I/O activity. No fixed TDP or fan specification is defined for the bare device. System integrators must plan cooling and supply margins based on their own bitstream and board layout.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $242.99
Pricier than about 88% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How is the XC6SLX25T-2CSG324C FPGA installed on a 324-pin CSBGA footprint, and what step do engineers often miss?

The device uses a 324-ball CSBGA package that requires reflow soldering; the step most often missed is applying the correct thermal profile for lead-free balls to avoid cold joints under the array.

What maintenance or replacement will the XC6SLX25T-2CSG324C FPGA need during its service life?

As a non-volatile programmable logic IC, it needs no scheduled maintenance; replacement is only required if the device suffers electrical overstress or the design migrates to a different density.

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