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Small square black FBGA-256 chip with grid of solder balls on underside

YINGHUA

YINGHUA XC6SLX9-2FTG256I FPGA semiconductor FBGA-256

SKU CH-5MBH-V90FC

FPGA semiconductor in a 256-ball FBGA package for custom logic designs

  • Product typeICs Semicoductors
  • FPGA enables custom logic design
  • FBGA-256 package suits dense board layouts
  • New condition ensures full factory specification
  • Xilinx Spartan-6 architecture delivers reconfigurable performance

FPGA with FBGA-256 packaging

The YINGHUA XC6SLX9-2FTG256I is a field-programmable gate array supplied in a 256-ball FBGA package. It targets engineers and developers building custom digital logic for embedded systems, signal processing or prototyping. The device provides reconfigurable fabric suited to low-to-mid density designs requiring flexible I/O assignment.

Sustained thermal behaviour under continuous logic

Under prolonged switching activity the silicon temperature rises until the package and board thermal path reach equilibrium. Stable operation relies on adequate PCB copper spreading and airflow to keep the junction within specified limits. Designs with high toggle rates or dense logic utilisation demand careful thermal analysis. The part is not suited to applications needing on-chip high-speed transceivers or hardened processor cores.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $521.99
Pricier than about 91% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How much heat does the XC6SLX9-2FTG256I generate during continuous operation?

Power dissipation depends on the logic design, clock frequencies and I/O activity programmed into the device; the datasheet provides static and dynamic power equations for thermal planning.

What programmer or development board is needed to configure the FBGA-256 FPGA?

A JTAG-compatible programmer such as a Xilinx Platform Cable USB or a development board with a 256-ball FBGA footprint is required to load the bitstream.

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