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Small square black chip with grid of 324 solder balls underneath

YINGHUA

YINGHUA XC7A50T-2CSG324I FPGA semiconductor

SKU CH-C7AY-CD8CW

Field-programmable gate array with 50K logic cells in a 324-ball CSBGA package

  • Product typeICs Semicoductors
  • 50K logic cells enable complex programmable designs
  • 324-ball CSBGA package suits dense board layouts
  • Field-programmable architecture allows post-production logic changes
  • New condition ensures full manufacturer specifications met

FPGA with 50K logic cells

The XC7A50T-2CSG324I is a field-programmable gate array built for engineers who need reconfigurable logic in a compact CSBGA-324 package. It suits prototyping, signal-processing and custom-acceleration tasks where a fixed ASIC would be too rigid or costly.

Replaces discrete logic and smaller FPGAs

The device steps up from CPLDs or lower-density FPGAs when designs exceed their logic-cell budget or I/O count. The jump is worth it when a project needs the 50K-cell capacity and 324-ball footprint but does not require the higher density or transceiver count of larger Artix-7 or Kintex parts.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $307.99
Pricier than about 90% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What board footprint does the CSBGA-324 package require?

The CSBGA-324 package needs a 324-ball grid array footprint with matching ball pitch and pad dimensions for surface-mount soldering.

What is the critical step when reflow-soldering this FPGA to avoid cold joints?

Follow the manufacturer's exact reflow profile; the most common error is insufficient peak temperature or too short a time above liquidus for the dense 324-ball array.

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