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YINGHUA

YINGHUA XC7S25-1CSGA225I FPGA Field Programmable Array CSBGA-225 semiconductor

SKU CH-XHH8-NNPWQ

A 25 K logic-cell FPGA in a 225-ball CSBGA package for custom digital logic implementation

  • Product typeICs Semicoductors
  • 25K logic cells enable flexible digital designs
  • CSBGA-225 package fits dense board layouts
  • Industrial temperature rating ensures reliable operation
  • Field-programmable architecture supports rapid prototyping

Spartan-7 FPGA with 25K logic cells

The XC7S25-1CSGA225I is a Spartan-7 field-programmable gate array packaged in a 225-ball chip-scale BGA. It targets engineers building custom logic for embedded systems, signal processing or protocol bridging where a fixed-function ASIC is not justified.

Replaces discrete logic or older CPLDs

The jump is worth it when a design needs more programmable resources than a complex programmable logic device can provide, or when soft-processor cores and high-speed transceivers must share one die. Buyers who need larger logic capacity or a different package footprint should look elsewhere.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $96.99
Pricier than about 80% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What footprint does the CSBGA-225 package require on the PCB?

The CSBGA-225 package uses a 225-ball chip-scale ball grid array footprint that must match the board land pattern and solder-mask openings for reliable reflow.

Which reflow-profile step is most often mishandled when soldering this BGA?

Exceeding the peak temperature or extending time above liquidus during lead-free reflow commonly causes package warpage or solder-ball bridging on the 225-ball array.

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