YINGHUA XC7S50-1FTGB196I FPGA semiconductor 50 196
A field-programmable gate array with 50 logic cells in a 196-ball CSBGA package
- Product typeICs Semicoductors
- Field-programmable logic for custom hardware acceleration
- 50 logic cells enable scalable design density
- CSBGA-196 package provides 196 ball connections
- New condition ensures full factory specification compliance
XC7S50 FPGA for Logic Integration
The XC7S50-1FTGB196I is a field-programmable gate array built for custom digital logic in embedded and industrial systems. It provides 50 thousand logic cells in a 196-ball chip-scale BGA package. Engineers use it to implement proprietary interfaces, signal processing pipelines or control functions that standard microcontrollers cannot handle.
Replaces Discrete Logic and Older Arrays
This device consolidates multiple CPLDs, glue logic or earlier-generation FPGAs into a single programmable chip. The upgrade is justified when a design needs more lookup tables, block RAM or DSP slices than the previous solution offers. It is not suited for applications requiring hard processor cores, high-speed transceivers or larger logic capacities.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $134.99
- Pricier than about 82% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
What board footprint does the CSBGA-196 package require?
The CSBGA-196 package needs a 196-ball chip-scale BGA footprint with matching pad array and solder-mask openings.
Which step is most often missed when hand-soldering this FPGA?
Applying the correct reflow profile for the 196-ball CSBGA package is the step most often missed; incorrect peak temperature or ramp rate causes solder defects.
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