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Square black FBGA chip with 2577 solder balls on the underside

YINGHUA

YINGHUA XCVU9P-2FLGA2577I FPGA 2577

SKU CH-R1KE-4W9Q3

Field-programmable gate array in a 2577-ball FBGA package for custom logic acceleration

  • Product typeICs Semicoductors
  • FPGA architecture enables custom logic acceleration
  • 2577-ball FBGA package supports high-density integration
  • Field-programmable design allows post-deployment reconfiguration
  • New condition ensures factory-original performance and reliability

YINGHUA XCVU9P-2FLGA2577I FPGA

The YINGHUA XCVU9P-2FLGA2577I is a field-programmable gate array supplied in a 2577-ball FBGA package. It provides reconfigurable logic resources for custom hardware acceleration and digital signal processing tasks. Engineers use this device to implement application-specific functions that can be updated after deployment. The component is new and intended for integration into custom board-level designs.

Suits logic designers building high-density

This FPGA fits teams developing bespoke compute pipelines, protocol bridges or real-time signal chains that demand a large programmable fabric in a 2577-ball FBGA footprint. It is not suitable for buyers seeking a fixed-function ASIC, a microprocessor with an instruction-set architecture, or a device in a different package or pin count. Projects requiring integrated hard processor cores or specific hardened IP blocks not confirmed in the data should evaluate alternative devices.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $810.99
Pricier than about 91% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What does the 2577 figure tell me about the physical size of this FPGA?

The 2577 refers to the FBGA package ball count, which determines the board footprint and routing density you must design for.

How does the 2577 ball count affect real-world implementation?

A 2577-ball FBGA package needs a matching PCB land pattern and careful power distribution; the high I/O count supports wide memory interfaces and multi-gigabit transceivers.

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