YINGHUA XCVU9P-2FLGA2577I FPGA semiconductor
Field-programmable gate array in a 2577-ball FBGA package for custom logic designs
- Product typeICs Semicoductors
- High-density logic integration with 2577-pin FBGA package
- Field-programmable architecture enables custom hardware acceleration
- New condition ensures full factory specification compliance
- Semiconductor-grade IC delivers reliable programmable logic performance
XCVU9P FPGA for custom logic integration
The XCVU9P-2FLGA2577I is a field-programmable gate array in a 2577-ball FBGA package designed for engineers building custom digital logic. It suits prototyping, signal-processing pipelines and hardware-acceleration tasks that demand reconfigurable fabric rather than fixed-function silicon.
Replaces fixed ASICs when design flexibility
The jump is worth it when requirements shift late in development, when low-volume production cannot amortise mask sets, or when the same hardware must serve multiple protocols over its lifetime. It is not for buyers who need a ready-made processor with a standard instruction set or a fixed-function accelerator.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $5,088.99
- Pricier than about 99% of the 1,027 comparable items (median $34.99).
Specifications
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| Product type | ICs Semicoductors |
Questions about this item
What board footprint does the FBGA-2577 package of this XCVU9P FPGA require?
The FBGA-2577 package uses a 2577-ball grid array footprint; design the PCB with matching ball pitch and pad layout for this specific package.
What is the critical installation step for this FBGA-2577 FPGA that is often missed?
Apply a precise reflow profile for the 2577-ball FBGA package and follow the manufacturer's moisture-sensitivity handling instructions before soldering.
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