Electronix Express High Temperature Solderless Breadboard 830 Tie Points 6.5" x 2.14
- Prototyping Products
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A 9-DOF IMU with on-board sensor fusion delivering 100 Hz orientation data over I2C, assembled with header pins
The BNO055 integrates a Cortex-M0 processor with a MEMS accelerometer, magnetometer and gyroscope on one die. It performs sensor fusion internally and delivers absolute orientation, angular velocity, acceleration and magnetic field data. The board ships assembled and tested with a short header strip for quick breadboard use. It is aimed at engineers and makers who need reliable 3D orientation without writing fusion algorithms.
The breakout communicates over I2C, so verify your host has an available bus and can operate at the board's logic level. Confirm the default I2C address does not conflict with other devices on the same bus. Ensure your firmware can request Euler vectors or quaternions at up to 100 Hz and magnetic data at 20 Hz. The small header requires soldering if a permanent connection is needed.
This module replaces a separate accelerometer, gyroscope and magnetometer plus the software effort to fuse their outputs. The jump is worth it when development time matters more than raw sensor access, or when a validated orientation output is required at 100 Hz. It is not for projects that need direct register control of each MEMS element or a different communication protocol.
Measured against everything we stock in Engineering Workstations & Dev Kits, at today’s prices. Recalculated every night.
| Product | |
|---|---|
| Product type | Engineering Development Tools |
It arrives assembled and tested with a small piece of header already fitted.
Only this single BNO055 breakout is listed, so there are no alternative versions or capacities to select.
Orientation, angular velocity and acceleration update at 100 Hz while magnetic field strength updates at 20 Hz, giving fast orientation data and slower compass readings.
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