MSI 939-S336-002 1U barebone server AM5 B650 4 DDR5 2×10G 2×2.5" 450W redundant
- Single AMD Ryzen 70…
- 1U
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Eight-GPU barebones server with dual Xeon processors and 900GB/s interconnect for large-scale AI and HPC workloads
This ASUS HGX system is a 7U barebones server built for large-scale AI and high-performance computing. It integrates eight NVIDIA H200 GPUs with dual 5th Gen Intel Xeon Scalable processors. The platform targets organisations training massive generative models or running dense HPC simulations. It is not suited for buyers who need a compact tower or a general-purpose file server.
The thermal design uses dedicated CPU and GPU airflow tunnels plus support for direct-to-chip liquid cooling to handle extreme heat loads. Four-plus-two 80 PLUS Titanium power supplies deliver high-efficiency conversion for the dual 350W TDP processors and eight accelerators. A modular layout reduces internal cabling to improve airflow paths. Buyers without facility liquid-cooling infrastructure cannot use the D2C option.
A dedicated one-GPU-to-one-NIC architecture supports up to eight network interfaces for maximum throughput during compute-intensive workloads. GPU-to-GPU interconnect via NVLink provides 900GB/s bandwidth for efficient multi-GPU scaling. The chassis offers up to 12 PCIe slots for additional expansion cards. Organisations needing only single-GPU inference will find the networking topology excessive.
Measured against everything we stock in Barebone Servers & DIY Kits, at today’s prices. Recalculated every night.
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| Size & build | |
|---|---|
| Shipping weight | 22.68 kg |
| Package size | 508 × 457 × 254 mm |
Route the cold-plate manifolds through the dedicated CPU and GPU airflow tunnels, then pressure-test every quick-connect fitting before powering on; the step most often missed is torquing each fitting to spec after the first thermal cycle.
The 4+2 80 PLUS Titanium power supplies are the primary field-replaceable units; plan on swapping any supply that exceeds its rated MTBF or shows efficiency drift.
The 350 W TDP per processor sets the ceiling; once combined CPU and GPU heat load saturates the direct-to-chip loop capacity, temperatures climb and throttling begins.
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