ASUS ROG STRIX X870-I GAMING WIFI AMD motherboard
- Ryzen 7000 Series /…
- AMD X870
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AM5 board with 16+2+2 90 A power stages, four DDR5 slots up to 256 GB, dual PCIe 5.0 M.2 plus two PCIe 4.0 M.2, WiFi 7, 5 GbE and dual USB4
The ASUS ROG STRIX X870E-A GAMING WIFI7 NEO is an AMD ATX motherboard built for the AM5 socket. It supports Ryzen 7000, 8000 and 9000 Series desktop processors. A 16+2+2 power stage design rated for up to 90A per stage delivers stable current for multi-core workloads. Dual ProCool II connectors, alloy chokes and durable capacitors complete the robust power solution.
Four 288-pin DDR5 slots accept up to 256GB in dual-channel mode. Supported overclock speeds reach 9600 MT/s with Ryzen 8000 Series and 9000 MT/s with Ryzen 9000 Series. Intel XMP 3.0 and AMD EXPO profiles are both supported. NitroPath DRAM Technology, DIMM Fit Pro and AEMP simplify memory tuning and improve signal integrity.
One PCIe 5.0 x16 slot runs at x16 mode with Ryzen 9000 and 7000 Series CPUs. Two M.2 slots support PCIe 5.0 x4 and two more support PCIe 4.0, all with substantial heatsinks. Dual USB4 Type-C ports, WiFi 7 and Realtek 5Gb Ethernet provide high-speed I/O. The SupremeFX 7.1 audio codec ALC4080 handles front and rear headphone outputs with impedance sensing.
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| Product | |
|---|---|
| Brand name | ASUS |
| Model name | ROG STRIX X870E-A GAMING WIFI7 NEO |
| Processor | |
| Processor | Ryzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series |
| CPU socket | AM5 |
| Chipset | AMD X870E |
| Memory | |
| Memory slot count | 4 × 288pin (DDR5) |
| Max supported RAM | 256 GB |
| Memory channels | Dual Channel |
| Memory profiles | Intel XMP 3.0 / AMD EXPO |
| ECC support | Non-ECC |
| Buffering | Un-buffered |
| Storage | |
| SATA ports | 4 x SATA 6Gb/s |
| M.2 slots | AMD Ryzen 9000 & 7000 Series Desktop Processors M.2_1 slot (Key M), type 2242/2260/2280 (supports PCIe 5.0 x4 mode) M.2_2 slot (Key M), type 2280/22110 (supports PCIe 5.0 x4 mode)** AMD Ryzen 8700 & 8600 & 8400 Series Desktop Processors M.2_1 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) M.2_2 slot (Key M), type 2280/22110 (supports PCIe 4.0 x4 mode)** AMD Ryzen 8500 & 8300 Series Desktop Processors M.2_1 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) M.2_2 slot (Key M), type 2280/22110 (Not supports) AMD X870E Chipset M.2_3 slot (Key M), type 2280 (sup |
| SATA and RAID support | AMD RAIDXpert2 Technology Ryzen 9000 & 8000 & 7000 Series Processors: RAID 0/1/5/10 |
| Audio & video | |
| Sound channels | ROG SupremeFX 7.1 Surround Sound High Definition Audio CODEC ALC4080* - Impedance sense for front and rear headphone outputs - Supports: Jack-detection, Multi-streaming, Front Panel MIC Jack-retasking - High quality 120 dB SNR stereo playback output and 110 dB SNR recording input - Supports up to 32-Bit/384 kHz playback on front panel Audio Features - SupremeFX Shielding Technology - Savitech SV3H712 AMP - Rear optical S/PDIF out port - Premium audio capacitors - Audio cover * The LINE OUT port on the rear panel does not support spatial audio. If you wish to use spatial audio, make s |
| Connectivity | |
| Maximum network speed | 5 Gbit/s |
| Wi-Fi standard | Wi-Fi 802.11 be |
| Bluetooth support | 5.4 |
| Power | |
| Power connectors | 1 × 24-pin Main Power connector 2 × 8-pin +12 V CPU Power connector |
| Size & build | |
| Form factor | ATX |
| Width and length | 12.0 in × 9.6 in |
| Shipping weight | 2.59 kg |
| Package size | 351 × 279 × 71 mm |
| More details | |
| BIOS | 64 MB (512Mb) Flash ROM, UEFI AMI BIOS |
The 16+2+2 phase arrangement with 90A per stage delivers stable current to multi-core Ryzen 7000, 8000 and 9000 series processors, supporting sustained boost clocks and overclocking headroom without throttling.
With a Ryzen 9000 processor the top x16 slot runs at PCIe 5.0 x16 and the M.2_1 slot runs at PCIe 5.0 x4, giving full bandwidth to next-gen GPUs and the fastest SSDs.
Yes, the board has four 288-pin DDR5 slots supporting up to 256 GB total, and the DIMM Fit Pro design plus NitroPath routing are engineered to clear large heatsinks while maintaining signal integrity.
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