ASUS ROG MAXIMUS Z890 APEX Intel motherboard
- Core Ultra Processo…
- Intel Z890
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ATX board for 12th, 13th and 14th Gen Intel CPUs with DDR5 to 7200 OC, PCIe 5.0 slot, three PCIe 4.0 M.2 sockets, 2.5Gb Ethernet and WiFi 6
This ATX motherboard uses the Intel B760 chipset and an LGA 1700 socket. It supports 14th 13th and 12th Gen Intel Core Pentium Gold and Celeron processors. Four 288 pin DDR5 slots accept up to 192 GB in dual channel mode with Intel XMP 3.0 profiles.
A 12 plus 1 DrMOS power stage design works with a six layer PCB and 8 plus 4 ProCool sockets. Enlarged VRM heatsinks M.2 heatsinks and a PCH heatsink provide comprehensive cooling. Hybrid fan headers and Fan Xpert 4 allow precise fan control for quieter operation.
Realtek 2.5 Gb Ethernet and Intel WiFi 6 deliver wired and wireless networking. Two way AI Noise Cancelation reduces background noise from microphone and audio output. Rear USB 3.2 Gen 2x2 Type C front panel USB 3.2 Gen 2 Type C header and Thunderbolt USB4 header support expand connectivity options.
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| Product | |
|---|---|
| Brand name | ASUS |
| Model name | TUF GAMING B760-PLUS WIFI |
| Part number | 90MB1ER0-M0AAY0 |
| Processor | |
| CPU socket | LGA 1700 |
| Chipset | Intel B760 |
| Memory | |
| Memory slot count | 4 × 288pin (DDR5) |
| Supported memory | DDR5 7200(OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600/ 5400/5200/ 5000/ 4800 Non-ECC, Un-buffered Memory* * Supported memory types, data rate (speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information please refer to CPU/Memory Support under the Support tab or visit https://www.asus.com/support/ * Non-ECC, un-buffered DDR5 memory supports On-Die ECC function. |
| Max supported RAM | 192 GB |
| Memory channels | Dual Channel |
| Memory profiles | Intel XMP 3.0 |
| Storage | |
| SATA ports | 4 x SATA 6Gb/s |
| M.2 slots | Intel 13th & 12th Gen Processors M.2_1 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) Intel B760 Chipset M.2_2 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 4.0 x4 mode) M.2_3 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) |
| SATA and RAID support | Intel Rapid Storage Technology supports SATA RAID 0/1/5/10. |
| Audio & video | |
| Audio chip | Realtek 7.1 Surround Sound High Definition Audio CODEC - Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking - Supports up to 24-Bit/192 kHz playback Audio Features - Audio Shielding - Rear optical S/PDIF out port - Premium audio capacitors - Dedicated audio PCB layers - Audio cover |
| Sound channels | 7.1 Channels |
| Connectivity | |
| Ethernet controller | 1 x Realtek 2.5Gb Ethernet TUF LANGuard |
| Maximum network speed | 2.5 Gbit/s |
| Wi-Fi standard | Wi-Fi 6 2 × 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) Supports 2.4/5 GHz frequency band |
| Bluetooth support | v5.2* *The Bluetooth version may vary, please refer to the Wi-Fi module manufacturer's website for the latest specifications. |
| Ports & slots | |
| PCIe 5.0 x16 slots | Intel 13th & 12th Gen Processors 1 x PCIe 5.0 x16 slot |
| PCIe x1 slots | 2 x PCIe 3.0 x1 slots* |
| Onboard USB headers | 1 x USB 3.2 Gen 2 connector (supports USB Type-C ) 1 x USB 3.2 Gen 1 header supports 2 additional USB 3.2 Gen 1 ports 2 x USB 2.0 headers support 4 additional USB 2.0 ports |
| Power | |
| Power connectors | 1 × 24-pin Main Power connector 1 × 8-pin +12 V Power connector 1 × 4-pin +12 V Power connector |
| Size & build | |
| Form factor | ATX |
| Width and length | 12.0 in × 9.6 in |
| Shipping weight | 1.98 kg |
| Package size | 355 × 275 × 70 mm |
| Compatibility | |
| Windows 11 support | Supported |
Align the triangle on the processor with the socket marker, lower the retention lever gently, then connect both the 8-pin and 4-pin ProCool power cables so the 12+1 DrMOS stages receive full current.
The VRM heatsinks, PCH heatsink and three M.2 heatsinks are passive; only the chassis fans plugged into the hybrid headers wear out and should be swapped when noise or airflow drops.
The 12+1 DrMOS power stages hit their temperature ceiling before the six-layer PCB or the enlarged VRM heatsinks saturate, so case airflow must keep the heatsink fins moving air.
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