Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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Dual-channel 16 GB kit (2 × 8 GB) of DDR3L 1600 CL11 SO-DIMM memory for Asus G73 notebooks
This 16 GB kit contains two 8 GB SO-DIMM modules built for the ASUS/ASmobile G73 G73Sw-Bst8 notebook. The memory runs at 1600 MHz with CL11 timings and operates at 1.35 V. It is intended for owners of that exact model who need to reach the platform's 16 GB ceiling.
The unbuffered, non-ECC modules have no heat spreader and draw power at the standard DDR3L voltage of 1.35 V. Typical notebook cooling handles the thermal load without extra airflow. Acoustic impact is negligible because the sticks add no moving parts.
The package supplies two 204-pin sticks and nothing else. No software, drivers or installation tools are included. The lifetime warranty from Computer Memory Solutions applies when the kit is purchased directly from the manufacturer.
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| Product | |
|---|---|
| Brand name | Computer Memory Solutions |
| Model name | CM10246412800SODRL |
| Total capacity | 16 GB (2 × 8 GB) |
| Product type | 204-Pin DDR3 SO-DIMM |
| Performance | |
| Rated speed | DDR3L 1600 (PC3L 12800) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | CL11 |
| Memory timings | 11-11-11 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 2Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.35 V |
| Compatibility | |
| Compatible systems | Asus/Asmobile G73 Notebook G73Sw-Bst8 Notebook |
| In the box | |
| Included items | 2 Memory RAM Sticks |
Power off the notebook, remove the battery, open the memory compartment, insert each 8 GB stick at an angle until the gold contacts disappear, then press down firmly until both side clips click — the step most often missed is pressing down hard enough to engage both clips.
No scheduled maintenance is required; the unbuffered non-ECC modules have no heat spreader, so keeping the laptop vents clear of dust preserves operating temperature, and replacement is only needed if a module fails.
The platform caps each socket at 8 GB, so the 16 GB (2 × 8 GB) kit already reaches the maximum supported capacity; beyond that the bottleneck becomes the notebook's two-slot limit rather than the memory speed or voltage.
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