Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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16 GB kit of two 8 GB DDR3L SODIMM modules at 1600 MHz CL11 for Asus X552Ep, X550Ze and X550Za notebooks
This 16GB kit delivers two 8GB DDR3L SODIMM modules built for the Asus X Series notebooks X552Ep, X550Ze and X550Za. It targets owners of those models who need the full 16GB capacity across both memory slots. Buyers with other laptop families or desktop platforms should look elsewhere, as the 204-pin DDR3L form factor and validated compatibility list are specific to these systems.
Running at DDR3L 1600 (PC3L 12800) with CL11 11-11-11 timings, the modules operate at 1.35V rather than the standard 1.5V. The lower voltage reduces power draw and heat output inside the confined notebook chassis. No heat spreader is fitted, so the sticks rely on the laptop's existing cooling path; acoustic impact is negligible because the memory itself has no moving parts.
The package contains two 8GB unbuffered, non-ECC SODIMMs ranked 2Rx8 with major-brand chipsets. Installing the pair fills both sockets, enabling dual-channel bandwidth on supported platforms. The manufacturer guarantees compatibility with the listed Asus models and backs the kit with a limited lifetime warranty when purchased directly from Computer Memory Solutions; product appearance may vary from the reference image.
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| Product | |
|---|---|
| Brand name | Computer Memory Solutions |
| Model name | CM10246412800SODRL |
| Total capacity | 16 GB (2 × 8 GB) |
| Product type | 204-Pin DDR3 SO-DIMM |
| Performance | |
| Rated speed | DDR3L 1600 (PC3L 12800) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | CL11 |
| Memory timings | 11-11-11 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 2Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.35 V |
| Compatibility | |
| Compatible systems | Asus/Asmobile X Series Notebook X552Ep, X550Ze, X550Za |
| In the box | |
| Included items | 2 Memory RAM Sticks |
Power off the notebook, remove the battery if accessible, open the memory compartment, align the notch on each 204-pin module with the slot key, press firmly until both side clips click, then reassemble; the step often missed is verifying both clips lock fully before closing the case.
No scheduled maintenance is required for the unbuffered non-ECC modules; replacement is only needed if a stick fails, which is covered by the manufacturer's limited lifetime warranty against manufacturing defects.
The platform's two-slot maximum of 16GB is reached with this kit, so capacity is the first constraint; thermal throttling of the DDR3L chips can also occur under prolonged heavy load.
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