Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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A matched 2×8 GB DDR3 kit running at 1600 MHz with CL11 latency and 1.5 V unbuffered 240-pin DIMMs
This kit provides two 8 GB DDR3 modules rated at 1600 MHz with CL11 timing and 1.5 V operation. The 240-pin unbuffered DIMMs are built for desktop systems that require PC3-12800 non-ECC memory. Matching parts help the platform run in dual-channel mode for full bandwidth.
The kit suits owners of older desktops or workstations that specify DDR3 1600 non-ECC memory in a 240-pin form factor. Systems that require registered or ECC modules, or platforms limited to lower DDR3 speeds, should select different memory.
The decisive specification is the 1600 MHz (PC3-12800) data rate; the motherboard and CPU must support this speed for the modules to operate at their rated frequency. If the platform caps memory at a lower DDR3 speed, the kit will downclock accordingly.
Measured against everything we stock in Model-Specific Memory Upgrades, at today’s prices. Recalculated every night.
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| Product | |
|---|---|
| Part number | CM10246412800DIMM |
| Total capacity | 8 GB |
| Performance | |
| Rated speed | DDR3 1600 (PC3 12800) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | 11 |
| Memory timings | 11-11-11 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 2Rx8 |
| Power | |
| Rated voltage | 1.5 V |
Align the notch on each module with the slot key, press down firmly until both retention clips click shut, then verify the OS reports the full 16 GB; the step most often missed is seating both ends evenly so the clips engage automatically.
No scheduled maintenance is required; keep the gold contacts clean and dust the slots with compressed air if the system is opened, and replace only if a module fails the lifetime warranty check.
The DDR3 1600 MT/s data rate and CL11 latency set the throughput ceiling; under continuous heavy use the memory controller hits that bandwidth limit before voltage or thermal constraints become an issue.
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