Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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2GB DDR2 667MHz SODIMM module upgrades HP G50 notebook memory with CL5 timing
This 2 GB DDR2-667 module upgrades HP/Compaq G50 series notebooks that accept 200-pin PC2-5300 SO-DIMMs. It is a single unbuffered stick with CL5 timing and 1.8 V operation. The part carries the CM256645300SO designation from Computer Memory Solutions.
Standard DDR2 SO-DIMMs run without a heat spreader and draw little power at 1.8 V, so they add negligible heat inside a notebook chassis. No moving parts mean silent operation. The module stays within the thermal envelope designed for the G50 platform.
The package contains one memory stick only; no tools, adapters or software are included. Installation is a simple slot insertion that restores or expands system memory for everyday tasks. Buyers who need more than 2 GB or a second module for dual-channel operation must purchase additional sticks separately.
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| Product | |
|---|---|
| Brand name | Computer Memory Solutions |
| Model name | CM256645300SO |
| Total capacity | 2 GB |
| Product type | 200-Pin DDR2 SO-DIMM |
| Performance | |
| Rated speed | DDR2 667 (PC2 5300) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | CL5 |
| Memory timings | 5-5-5 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 2Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.8 V |
| Compatibility | |
| Compatible systems | Hp/Compaq G Notebook G50 Series,-667 |
| In the box | |
| Included items | 1 Memory RAM Stick |
Power off the notebook, remove the battery, open the memory access panel on the underside, align the notch on the module with the slot key, insert at a 30-degree angle, then press down firmly until the side clips click into place.
No routine maintenance is required; if the notebook becomes unstable, reseat the module and clean the gold contacts with a soft eraser, otherwise the stick runs for the life of the system.
The CL5 latency at 1.8V sets the bandwidth ceiling, so prolonged heavy workloads hit the DDR2-5300 throughput limit before thermal throttling becomes a factor.
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