Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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2 GB DDR3 SO-DIMM running at 1066 MHz with CL7 timing for HP Mini 110 series notebooks
This 2 GB DDR3 1066 SO-DIMM is built for the HP Mini 110-3731Cl, 110-3735Dx, 110-3744Ca and 110-3744Tu models. It delivers a direct memory increase for owners of those specific netbooks who need more capacity for everyday tasks.
The stick matches the PC3 8500 speed, CL7 timing and 1.5 V voltage of the memory shipped with the listed Mini 110 units. Swapping the original 1 GB or 2 GB module for this 2 GB unit is worthwhile when the system feels sluggish with multiple browser tabs or office applications open.
Confirm your netbook carries one of the four model numbers above before ordering. These machines have a single SO-DIMM slot, so the new module will become the only memory in the system. Ensure you are comfortable opening the memory compartment on the underside of the chassis.
Measured against everything we stock in Model-Specific Memory Upgrades, at today’s prices. Recalculated every night.
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| Product | |
|---|---|
| Brand name | Computer Memory Solutions |
| Model name | CM256648500SO |
| Total capacity | 2 GB |
| Product type | 204-Pin DDR3 SO-DIMM |
| Performance | |
| Rated speed | DDR3 1066 (PC3 8500) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | CL7 |
| Memory timings | 7-7-7 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 1Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.5 V |
| Compatibility | |
| Compatible systems | Hp Mini 110-3731Cl 110-3735Dx 110-3744Ca, 110-3744Tu |
| In the box | |
| Included items | 1 Memory RAM Stick |
Yes, the module uses the standard 204-pin SO-DIMM form factor required by the HP Mini 110-3731Cl and the other listed models.
No, the memory runs at standard 1.5 V with CL7 timings and is unbuffered, so the system detects it automatically without BIOS changes.
The module has no heat spreader, keeping the profile low and leaving surrounding components accessible for future service.
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