Cooler Master Hyper 212 Halo Black CPU Cooler RR-S4KK-20PA-R1
- 120 mm
- Black
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A compact 108x80x64mm aluminium fin stack on a copper base with four heat pipes dissipates up to 205W for Intel FCLGA 3647 narrow ILM servers and includes Shin-Etsu 7762 thermal grease
The Dynatron B8 is a passive heatsink assembly built for processors that use the FCLGA 3647 socket with a narrow integrated loading mechanism. It combines an aluminium stacked-fin array soldered to a copper base with four embedded heat pipes. Shin-Etsu 7762 thermal grease is pre-printed on the base for immediate installation.
This cooler targets 2U server builds where the CPU thermal design power reaches 205 W and the mounting pattern matches the narrow ILM. It includes both fabric and non-fabric package carriers to fit either carrier style. Builders needing active airflow, a different socket, or support beyond 205 W should look at other solutions.
The single figure that determines fit is the rated 205 W heat-dissipation limit. If the processor’s thermal output exceeds this value the heatsink cannot guarantee adequate cooling. Verify the CPU’s rated power against this ceiling before purchase.
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| Product | |
|---|---|
| Brand name | Dynatron |
| Model name | B8 |
| Product type | Heatsinks only |
| Size & build | |
| Cooler material | Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded |
| Heatsink dimensions | 108 × 80 × 64 mm |
| Product weight | 600g |
| Shipping weight | 0.73 kg |
| Package size | 132 × 112 × 104 mm |
Both carriers are included; use the Fabric carrier when the motherboard has a narrow ILM with a fabric retention frame, otherwise use the Non-Fabric carrier.
The aluminium stacked-fin array soldered to a copper base with four embedded heat pipes is rated to dissipate up to 205 W of CPU heat in a 2U chassis.
The cooler stands 64.00 mm tall, fitting the 2U form factor required by the narrow ILM socket specification.
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