Cooler Master Hyper 212 Halo Black CPU Cooler RR-S4KK-20PA-R1
- 120 mm
- Black
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Copper vapor-chamber heatsink measuring 5.25 by 3.5 by 1.50 inches for efficient CPU cooling
The Dynatron T319 is a passive copper heatsink that uses a vapor chamber and stacked fins to spread heat from the processor. It suits builders who want silent operation or who plan to add their own airflow solution. Buyers needing an integrated fan or a liquid-cooling block will not find those features here.
At 5.25 by 3.5 by 1.50 inches the cooler occupies a compact footprint that leaves room for tall memory modules and nearby voltage-regulator heatsinks. The vapor-chamber base distributes heat across the fin stack so case fans can pull it away without a dedicated cooler fan. Ensure your chassis provides enough airflow to move heat from the fins.
The copper construction and vapor chamber give the T319 high thermal capacity, letting it absorb prolonged loads without rapid temperature spikes. Heat spreads evenly through the fin array so steady airflow keeps temperatures stable during long render or compile sessions. Without active cooling the heatsink will eventually saturate under continuous heavy work.
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| Product | |
|---|---|
| Brand name | Dynatron |
| Model name | T319 |
| Product type | Heatsinks only |
| Size & build | |
| Cooler material | Copper Stacked Fins with Vapor Chamber |
| Heatsink dimensions | 5.25 inx3.5 inx1.5 in |
| Shipping weight | 0.31 kg |
| Package size | 140 × 91 × 41 mm |
The heatsink measures 1.50 inches tall, 5.25 inches long and 3.5 inches wide.
The unit is supplied as heatsink only; a separate fan must be mounted for active cooling.
The package contains only the copper vapor-chamber heatsink; socket-specific brackets are not included.
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