Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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A 1GB dual-channel DDR2 667 kit with ECC fully buffered modules and heat spreaders for HP/Compaq systems
This 1GB kit contains two 512MB modules designed for HP and Compaq systems that require 240-pin DDR2 667 memory. The fully buffered architecture with ECC provides the error correction and signal integrity needed by compatible workstations and servers.
Rated DDR2 667 (PC2 5300) with CAS latency CL5, the modules operate at the standard 1.80 volt DDR2 voltage. A heat spreader on each DIMM helps dissipate heat during typical workloads without requiring active cooling.
Under continuous operation the fully buffered design maintains signal quality across the memory bus while ECC corrects single-bit errors in real time. Systems needing larger capacities or unbuffered memory will not support this kit.
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| Product | |
|---|---|
| Brand name | Kingston |
| Model name | KTH-XW667/1G |
| Total capacity | 1 GB (2 × 512 MB) |
| Product type | 240-Pin DDR2 SDRAM |
| Performance | |
| Rated speed | DDR2 667 (PC2 5300) |
| Memory | |
| CAS latency | CL5 |
| ECC support | Yes |
| Buffer type | Fully Buffered |
| Heat spreader | Yes |
| Power | |
| Rated voltage | 1.8 V |
| Size & build | |
| Shipping weight | 0.11 kg |
| Package size | 171 × 95 × 13 mm |
| Compatibility | |
| Compatible systems | HP/Compaq |
Power down the HP/Compaq workstation, open the chassis, and press each 240-pin module firmly into the paired DIMM slots until the retention clips click; the two 512MB sticks must occupy the matched channel slots for dual-channel mode.
The integrated heat spreader and ECC logic are solid-state with no moving parts; no scheduled cleaning, re-pasting, or component replacement is needed for the life of the modules.
Under continuous heavy memory traffic the fixed CL5 timing at 1.80V limits throughput before thermal throttling or voltage headroom become factors.
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