Aqua Plumb MPA1 Self Lighting Map/Pro Torch Auto Igniter Soldering
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Lead-free solder wire with 0.8 mm diameter, Sn99 Ag0.3 Cu0.7 alloy and rosin core melts at 419 °F for clean electronics joints
This lead-free solder wire uses a Sn99 Ag0.3 Cu0.7 alloy with a rosin core for electronics soldering. It suits hobbyists, technicians and anyone needing RoHS-compliant joints on copper pads or component leads. The 0.8 mm diameter works well on small parts and fine-pitch connections.
The flux core contains 2.5 % rosin so no separate flux is required during everyday soldering. A standard spool holds 50 g of wire and feeds cleanly from the reel during hand soldering or light rework. Melting point is 419 °F, compatible with common soldering irons and stations.
Replaces traditional leaded solder when lead-free compliance is required for commercial or residential equipment. The finer 0.032 in diameter improves control on dense boards compared with thicker wire. Not suited for plumbing, sheet-metal work or high-volume production that demands larger spools or different alloys.
Measured against everything we stock in Soldering Irons & Stations, at today’s prices. Recalculated every night.
| Compatibility | |
|---|---|
| Fit and compatibility | Copper, Electronics Soldering |
| Environment & compliance | |
| Certifications and standards | Solder Wire with flux, Lead Free, Diameter 0.8 mm/0.032 in, weight 50g 0.11 lb |
The wire is 0.8 mm (0.032 in) thick, letting it reach tight pads on small components and MCUs without bridging.
Each spool holds 50 g (0.11 lb) of wire with 2.5 % rosin core, a common size that fits most desktop dispensers.
The alloy melts at 419 °F, so set the iron a little above that point and feed wire to the joint, not the tip, to avoid cold solder.
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