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Lirealar

Lirealar TF8 Thermal Paste 13.8 W/mK 2.0g

SKU CH-5CFH-S988G MPN TF8

High-conductivity carbon-based paste rated at 13.8 W/mK, non-conductive and non-corrosive, with a 2.0 g syringe and applicator for CPU and GPU cooling

  • Net content2.0g
  • Thermal conductivity13.8 W/mK,
  • Continuous-use temperature-220 to 380 °C
  • DetailsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25
  • Key featuresHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive
  • High thermal conductivity of 13.8 W/mK moves heat efficiently from CPU and GPU
  • Non-electrically conductive carbon formula prevents short circuits on sensitive components
  • Non-corrosive, non-curing and non-toxic paste stays safe for long-term use
  • Easy-apply consistency fills microscopic gaps without voids even for first-time builders
  • Stable performance rated for at least six years without re-application needed

Carbon-based thermal compound

Lirealar TF8 is a carbon-based thermal compound with a rated conductivity of 13.8 W/mK. The 2.0 g syringe is intended for CPU, GPU and LED cooler interfaces on desktops and laptops. It is non-electrically conductive, non-corrosive and non-curing. The manufacturer states a service life of at least six years.

Who this suits and who it does not

Builders who need a non-conductive paste for standard processor and graphics card installations will find it straightforward to apply. Users who require a larger volume for multiple builds or a metal-based compound with higher conductivity should consider other options.

Thermal conductivity rating

The single figure that determines suitability is the 13.8 W/mK thermal conductivity. Match this value against the cooling requirement of your specific processor or graphics card before purchasing.

How it compares

Measured against everything we stock in Thermal Paste, at today’s prices. Recalculated every night.

Price $9.99
Cheaper than about 70% of the 498 comparable items (median $12.99).

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Specifications

Product
Product lineThermal Paste
Model nameTF8 Thermal Compound Paste
Performance
Thermal conductivity13.8 W/mK,
Size & build
Net content2.0g
Environment & compliance
Continuous-use temperature-220 to 380 °C

Other versions of this model

5 more in the same range

Questions about this item

Will the 13.8 W/mK TF8 paste work safely on an older CPU with a copper heat spreader?

Yes, the carbon-based compound is non-corrosive and non-electrically conductive, so it will not damage copper or aluminium surfaces on legacy processors.

How can I confirm the paste is performing correctly after I apply it?

Monitor CPU or GPU temperatures under load; the low thermal resistance below 0.01 °C-cm²/W and 13.8 W/mK conductivity should yield noticeably lower peak temps versus worn-out paste.

Does the 2.0 g syringe include a spreading tool, or must I buy one separately?

The retail pack ships with an application tool in the box, so no extra purchase is needed for installation.

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