Intel I350T4V2BLK network card 4 x RJ45 PCIe 2.1 x4
- 10/100/1000 Mbit/s
- EEE 802.3 (10BASE-T…
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Mini PCIe dual-port Gigabit Ethernet adapter with Intel I350 chip, wider RJ45 spacing and a heatsink for stable operation in compact industrial systems
The LR-LINK LRES2217PT is a Mini PCI Express network card that adds two Gigabit Ethernet ports to industrial computers and single-board systems. It uses the Intel I350 chip and fits full-height Mini PCIe slots where space is limited.
The card spaces its two RJ45 ports farther apart to accept industrial cables without interference. Thickened gold-plated connectors resist corrosion and maintain a solid link in vibration-prone environments. An integrated heatsink dissipates heat so the adapter runs stably inside poorly ventilated chassis.
Each port negotiates 10, 100 or 1000 Mbps over standard twisted-pair cabling. The Mini PCIe host interface caps total throughput to the bandwidth of a single PCIe lane, so sustained line-rate traffic on both ports simultaneously will saturate the bus. The design saves motherboard expansion resources by delivering dual ports through one slot.
Measured against everything we stock in Ethernet Cards & NICs, at today’s prices. Recalculated every night.
| Product | |
|---|---|
| Brand name | LR-LINK |
| Model name | LRES2217PT |
| Performance | |
| Rated speed | 10/100/1000 Mbit/s |
| Connectivity | |
| Supported standards | IEEE 802.3az |
| Ports & slots | |
| Interface type | Mini PCI Express |
| Connection types | 2 x RJ45 |
| Environment & compliance | |
| Temperature range | 0 °C to 55 °C |
| Humidity range | 0 % ~ 90 % (Non-condensing) |
The card uses an Intel I350 controller with standard drivers across Windows, Linux and VMware; no user-serviceable parts or scheduled firmware maintenance are required.
Each port is limited to 1000Mbps by the Gigabit Ethernet standard, so sustained wire-speed traffic on both ports simultaneously hits that 1000Mbps per-port ceiling.
The board includes an integrated heatsink rated for 0 °C to 55 °C ambient, designed to dissipate heat without active cooling in compact enclosures.
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