ModMyMods Adhesive Thermal Pad Blue 25mm 4.0 W/m-K
Adhesive thermal pad measuring 25mm square by 6mm thick with 4.0 W/m-K conductivity to transfer motherboard heat to the case
- Key featuresAdhesive Thermal Pad for Motherboard (Transfer Heat from Mot
- Transfers motherboard heat to the case with adhesive backing
- 0 W/m-K conductivity moves warmth efficiently
- 25 mm square pad fits tight VRM or chipset areas
- 6 mm thickness bridges uneven surfaces for full contact
- Blue colour aids visual inspection during installation
Adhesive Thermal Pad for Motherboard
This blue adhesive thermal pad measures 25 mm by 25 mm by 6 mm and conducts heat at 4.0 W/m-K. It is designed to transfer thermal energy from motherboard components directly to the computer case chassis. The self-adhesive backing simplifies installation on flat surfaces without separate retention hardware.
Thermal Interface Limits
The pad relies on direct contact between the motherboard hotspot and the metal case panel to function. Thermal resistance rises quickly if the mating surfaces are uneven, painted or separated by an air gap. It cannot bridge large height differences or replace a mounted heatsink with active airflow.
Capacity and Headroom
The 25 mm square footprint suits individual voltage-regulator modules, chipset packages or similar discrete components. A single pad handles moderate heat loads from one component but lacks the area for high-wattage devices or multiple hotspots. Builders needing broader coverage must apply several pads side by side.
How it compares
Measured against everything we stock in Thermal Paste, at today’s prices. Recalculated every night.
- Price $1.62
- Cheaper than about 99% of the 498 comparable items (median $12.99).
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Specifications
| Product | |
|---|---|
| Brand name | Generic |
| Model name | MOD-0044 |
| Part number | MOD-0044 |
Questions about this item
Should I pick the 25 mm square pad or a different size for my motherboard?
The pad measures 25 mm by 25 mm by 6 mm, so choose it when your component contact area matches those dimensions.
What does the 4.0 W/m-K rating mean once the pad is installed?
It indicates a thermal conductivity of 4.0 W/m-K, allowing heat to move from the motherboard to the case at that rate.
Does the adhesive layer change how the 4.0 W/m-K conductivity performs in practice?
The adhesive bonds the 25 mm pad directly to the surface, maintaining the stated 4.0 W/m-K path without extra mounting hardware.
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