Kingston Technology Corp. KVR333X64C25/1G 1GB DDR 333 PC 2700 CL2.5 184-Pin memory upgrade
- 1 GB
- DDR 333 (PC 2700)
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Eight-module DDR4 kit delivers 128 GB at 3200 MT/s with CL22 latency for ASRock TRX40 Taichi motherboards
This 128 GB kit contains eight 16 GB DDR4 UDIMM modules rated at 3200 MT/s with CL22 latency. It is validated for the ASRock TRX40 Taichi motherboard and runs at 1.20 V without ECC or registered buffering.
Modules operate at the standard 1.20 V DDR4 voltage and have no integrated heat spreader, so airflow from the CPU cooler or case fans provides all necessary cooling. Power draw follows normal DDR4 unbuffered behaviour at the rated speed and latency.
The box includes the eight matched modules only; no additional cables, software or installation tools are supplied. The kit is ready for direct installation into the motherboard's 288-pin slots.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | ASRock Gaming Motherboard Compatible Series Memory |
| Model name | ASRock DDR4 3200 MHz Non-ECC Unbuffered UDIMM |
| Part number | MD25600-618K8 |
| Total capacity | 128 GB (8 × 16 GB) |
| Product type | 288-Pin DDR4 UDIMM |
| Performance | |
| Rated speed | DDR4 3200 (PC4 25600) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL22 |
| ECC support | No |
| Buffer type | Unbuffered |
| Heat spreader | No |
| Memory rank | 1Rx8 |
| Power | |
| Rated voltage | 1.2 V |
| Compatibility | |
| Compatible systems | ASRock |
| In the box | |
| Included items | 128 GB (8 × 16 GB) DDR4 3200 MHz PC4-25600 1Rx8 1.2 V CL22 288-PIN Non-ECC Unbuffered UDIMM KIT |
Insert each 288-pin module into the eight DIMM slots following the motherboard's channel-population order; the step most often missed is seating both retention clips until they click audibly.
No scheduled maintenance is required; if a module fails, the lifetime replacement warranty covers a direct swap of the defective 16GB UDIMM.
The CL22 latency at 3200 MT/s sets the throughput ceiling before voltage or thermal limits become a factor.
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