Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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A 16 GB dual-channel kit of 1866 MHz DDR3 SODIMM modules at 1.35 V for compatible ASUS laptops and all-in-one PCs
This 16 GB kit contains two 8 GB DDR3 SODIMM modules rated at 1866 MHz with a CAS latency of 13. It is built for ASUS laptops, all-in-one PCs and small-form-factor desktops that accept 204-pin unbuffered non-ECC memory.
Running at 1.35 V reduces power draw and heat output compared with standard 1.5 V DDR3, helping keep thermals and fan noise low during everyday workloads. The modules carry no heat spreader, relying on the system's existing airflow.
The two modules are tested together to ensure timing consistency, letting the memory controller run in dual-channel mode for higher throughput. No additional software or accessories are included beyond the two SODIMMs themselves.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | ASUS Laptop, AIO All-in-One PC Compatible Series Memory |
| Model name | ASUS DDR3 1866 MHz Non-ECC Unbuffered SODIMM |
| Part number | MS14900-828LK2 |
| Total capacity | 16 GB (2 × 8 GB) |
| Product type | 204-Pin DDR3 SODIMM |
| Performance | |
| Rated speed | DDR3 1866 (PC3 14900) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL13 |
| ECC support | No |
| Buffer type | Unbuffered |
| Heat spreader | No |
| Memory rank | 2Rx8 |
| Power | |
| Rated voltage | 1.35 V |
| Compatibility | |
| Compatible systems | ASUS |
| In the box | |
| Included items | 16 GB (2 × 8 GB) DDR3 1866 MHz PC3-14900 2Rx8 1.35 V 204-PIN Non-ECC Unbuffered SODIMM KIT |
Power off the system, unplug it, remove the battery if accessible, open the memory compartment, align each module notch with the slot key, press firmly until the side clips click, then verify 16 GB appears in BIOS before closing the case.
No scheduled maintenance is required; the modules have no heat spreaders or moving parts, so replacement is only needed if a stick fails or the platform is upgraded beyond DDR3.
The DDR3 1866 MT/s bandwidth ceiling and CL13 latency become the bottleneck before the 1.35 V supply or thermal limits are reached.
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