Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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16 GB DDR4-3200 ECC unbuffered UDIMM with CL22 latency and 1.2 V operation for ASRock server boards
This 16GB DDR4 3200 ECC unbuffered UDIMM operates at 1.2V with CL22 latency and a 2Rx8 rank configuration. It uses a 288-pin form factor and is validated for ASRock Rack motherboards including the E3C252D4U, E3C252D4U-2T and E3C252D4ID-2T. Modules are built with major OEM chips from Samsung, Micron or Hynix and ship without a heat spreader.
This module suits administrators upgrading ASRock Rack platforms that require ECC unbuffered memory for data integrity. It is not for systems that only accept registered or load-reduced DIMMs. It is also not for desktop boards lacking ECC support in the BIOS or chipset. Buyers needing capacities beyond a single 16GB stick should look at larger kits or higher-density modules.
The CAS latency of CL22 at 3200 MT/s determines the module's timing profile and must match the motherboard's supported memory timings for stable operation. Verify that the target ASRock Rack board lists CL22 3200 ECC UDIMM compatibility before purchase. Mismatched timings can prevent boot or cause instability even if the physical pin count and voltage align.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | ASRock Server Motherboard Compatible Series Memory |
| Model name | ASRock DDR4 3200 MHz ECC Unbuffered UDIMM |
| Part number | ME25600-628K1 |
| Total capacity | 16 GB |
| Product type | 288-Pin DDR4 ECC UDIMM |
| Performance | |
| Rated speed | DDR4 3200 (PC4 25600) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL22 |
| ECC support | Yes |
| Buffer type | Unbuffered |
| Heat spreader | No |
| Memory rank | 2Rx8 |
| Power | |
| Rated voltage | 1.2 V |
| Compatibility | |
| Compatible systems | ASRock |
| In the box | |
| Included items | 16 GB (1 × 16 GB) DDR4 3200 MHz PC4-25600 2Rx8 1.2 V CL22 288-PIN ECC Unbuffered UDIMM |
The module has no heat spreader and no user-serviceable parts, so no firmware updates or component swaps are required after installation.
The 1.2 V operating voltage and CL22 latency set the power envelope; sustained loads will hit the JEDEC thermal limit before any electrical ceiling.
With no heat spreader or moving parts the stick is silent, and at 1.2 V its heat output stays within standard DDR4 UDIMM thermal limits.
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