Kingston Technology Corp. KVR333X64C25/1G 1GB DDR 333 PC 2700 CL2.5 184-Pin memory upgrade
- 1 GB
- DDR 333 (PC 2700)
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32 GB dual-channel DDR4 ECC registered server memory kit running at 3200 MT/s with CL22 latency for ThinkMate TWX-XS8 tower servers
This 32 GB kit contains two 16 GB DDR4 3200 RDIMM modules built for ThinkMate TWX tower servers. ECC and registered buffering protect data integrity in workloads that cannot tolerate silent corruption. The 1.2 V operating voltage matches standard DDR4 server specifications.
The two sticks are packaged as a single 32 GB kit so both channels receive identical 2Rx8 modules. This removes the guesswork of mixing capacities or ranks and lets the memory controller run in dual-channel mode from the first boot.
Without a heat spreader the modules fit tight server DIMM slots where clearance is limited. The standard 288-pin DDR4 RDIMM edge connector ensures mechanical compatibility with the ThinkMate TWX-XS8-14S3, TWX-XS8-24S3 and TWX-XS8-24S 3.1 tower platforms listed by the manufacturer.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | THINKMATE Server/Workstation Compatible Series Memory |
| Model name | THINKMATE DDR4 3200 MHz ECC RDIMM Registered Server Memory |
| Part number | MR25600-628K2 |
| Total capacity | 32 GB (2 × 16 GB) |
| Product type | 288-Pin DDR4 RDIMM |
| Performance | |
| Rated speed | DDR4 3200 (PC4 25600) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL22 |
| ECC support | Yes |
| Buffer type | Registered |
| Heat spreader | No |
| Memory rank | 2Rx8 |
| Power | |
| Rated voltage | 1.2 V |
| Compatibility | |
| Compatible systems | THINKMATE |
| In the box | |
| Included items | 32 GB (2 × 16 GB) DDR4 3200 MHz PC4-25600 2Rx8 1.2 V CL22 288-PIN ECC RDIMM Registered Server Memory KIT |
Registered DIMMs run at 1.20V with standard JEDEC timings; no firmware updates are required and normal server maintenance covers any re-seating.
The modules operate at 1.20V without heat spreaders, so case airflow must keep the DRAM temperature within JEDEC limits during sustained loads.
At 1.20V the pair draws minimal power and adds no audible noise; total system heat rise depends on chassis cooling, not the memory itself.
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