Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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512 GB DDR4 3200 ECC registered kit with sixteen 32 GB modules for Tyan TS75A-B8252 servers
This 512GB kit contains sixteen 32GB DDR4 3200 ECC registered DIMMs built for the Tyan Transport HX TS75A-B8252 server. IT teams upgrading that platform receive validated modules that match the board's registered memory requirement. Buyers needing unbuffered UDIMMs or non-ECC memory for workstation boards cannot use this kit.
Each module runs at 1.20V with no heat spreader, relying on chassis airflow for cooling. Registered DIMMs add negligible power draw compared with unbuffered equivalents at the same speed. The kit introduces no moving parts, so acoustic output is unchanged from the existing memory population.
On-die ECC corrects single-bit errors while registered signalling reduces electrical load on the memory controller. Samsung Micron or Hynix DRAM chips are used across the sixteen modules to meet server-grade qualification. No software utilities or additional accessories are included in the package.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | Tyan Server/Workstation Motherboard Compatible Series Memory |
| Model name | Tyan DDR4 3200 MHz ECC RDIMM Registered Server Memory |
| Part number | MR25600-328K16 |
| Total capacity | 512 GB (16 × 32 GB) |
| Product type | 288-Pin DDR4 RDIMM |
| Performance | |
| Rated speed | DDR4 3200 (PC4 25600) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL22 |
| ECC support | Yes |
| Buffer type | Registered |
| Heat spreader | No |
| Memory rank | 2Rx8 |
| Power | |
| Rated voltage | 1.2 V |
| Compatibility | |
| Compatible systems | Tyan |
| In the box | |
| Included items | 512 GB (16 × 32 GB) DDR4 3200 MHz PC4-25600 2Rx8 1.2 V CL22 288-PIN ECC RDIMM Registered Server Memory KIT |
Populate all 16 slots following the motherboard's channel order, seat each 288-pin module until the ejector tabs click, then verify in BIOS that all 512GB are detected at 3200 MT/s with ECC active.
The modules have no heat spreaders and run at 1.20V, so keep chassis airflow clean; ECC corrects single-bit errors, but any module that logs uncorrectable errors should be replaced individually.
The platform's memory-controller thermal envelope and the fixed CL22 latency at 3200 MT/s become the bottleneck before the 1.20V DRAM voltage or 2Rx8 rank structure does.
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