Kingston Technology Corp. KVR333X64C25/1G 1GB DDR 333 PC 2700 CL2.5 184-Pin memory upgrade
- 1 GB
- DDR 333 (PC 2700)
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32 GB dual-channel DDR4 kit with ECC registered modules at 3200 MHz CL22 for the Lenovo ThinkEdge SE360 V2
This 32 GB kit contains two 16 GB DDR4 ECC RDIMM modules built for the Lenovo ThinkEdge SE360 V2 AI server. Registered buffering and error-correcting code protect data integrity in continuous workloads. The modules run at 3200 MHz with CL22 latency at 1.2 V. No heat spreaders are fitted.
Adding this kit replaces smaller RDIMMs or non-ECC memory to reach 32 GB of registered capacity. The jump is worthwhile when the server runs virtualised workloads, databases or AI inference that demand ECC protection and registered signalling. Systems already populated with matching 3200 MHz RDIMMs will not see a speed increase.
The 288-pin DDR4 RDIMM form factor fits only platforms that support registered ECC memory at 1.2 V. Maximum capacity and population rules are set by the server motherboard and CPU memory controller. Mixed-rank or mixed-voltage configurations can prevent boot or reduce stability.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | NEMIX RAM Original Series Server Memory |
| Model name | DDR4 ECC RDIMM Registered Server Memory |
| Part number | MR25600-624K2 |
| Total capacity | 32 GB (2 × 16 GB) |
| Product type | 288-Pin DDR4 RDIMM |
| Performance | |
| Rated speed | DDR4 3200 (PC4 25600) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL22 |
| ECC support | Yes |
| Buffer type | Registered |
| Heat spreader | No |
| Memory rank | 2Rx4 |
| Power | |
| Rated voltage | 1.2 V |
| Compatibility | |
| Compatible systems | Lenovo |
| In the box | |
| Included items | 32 GB (2 × 16 GB) DDR4 3200 MHz PC4-25600 2Rx4 1.2 V 288-PIN ECC RDIMM KIT |
Yes, the kit uses 288-pin DDR4 RDIMM form factor which matches the slot type used in the ThinkEdge SE360 V2 server.
Install one module per channel following the motherboard manual slot order; a common mistake is populating both sticks in the same channel which limits capacity.
No, the memory chips are solid-state components with no moving parts and do not need scheduled maintenance or replacement under normal operation.
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