Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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64GB DDR5-6400 2Rx4 registered ECC RDIMM at 1.1V CL52, validated for Supermicro H14SHM motherboards
This 64 GB DDR5-6400 module is built to the precise rank, voltage and timing the Supermicro H14SHM motherboard expects. Registered ECC architecture ensures every slot runs fully populated at rated speed while correcting single-bit errors on the fly.
Operating at 1.10 V, the RDIMM draws minimal power and produces low heat without a spreader. Registered buffering offloads the memory controller, keeping system thermals stable even when all slots are populated.
Each stick delivers 64 GB in a 2Rx4 organisation, so total system memory scales with the number of slots your board supports. Builders needing smaller increments or non-ECC UDIMMs should look elsewhere.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | NEMIX RAM Original Series Server Memory |
| Model name | DDR5 ECC RDIMM Registered Server Memory |
| Part number | MR51200-924K1 |
| Total capacity | 64 GB |
| Product type | 288-Pin DDR5 RDIMM |
| Performance | |
| Rated speed | DDR5 6400 (PC5 51200) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL52 |
| ECC support | Yes |
| Buffer type | Registered |
| Memory rank | 2Rx4 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.1 V |
| Compatibility | |
| Compatible systems | Supermicro |
| In the box | |
| Included items | 64 GB DDR5 6400 MHz PC5-51200 2Rx4 1.1 V 288-PIN ECC RDIMM KIT |
Power down, open the chassis, align the 288-pin key notch with the slot, press firmly until both latches click, then follow the motherboard manual's exact DIMM population sequence for registered ECC modules.
No firmware updates are required for the memory itself; ECC correction runs automatically, and the major OEM DRAM chips are rated for continuous server operation without scheduled replacement.
The registered buffer and 1.1 V operation keep per-module power low, so the platform's memory-controller thermal envelope is typically reached before any module-level limit.
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