OWC 16GB DDR4 2400MHz CL17 1.2V 288pin Non-ECC UDIMM memory upgrade
- 16 GB
- DDR4 2400
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16 GB DDR4 2133 MHz CL15 SODIMM for HP 260 G2, 1.2 V unbuffered non‑ECC
This 16GB DDR4 module runs at 2133MHz with CL15 latency and 1.2V operation. It is built as a 260-pin non-ECC SODIMM for the HP 260 G2 platform. The upgrade targets owners of that system who need more memory capacity for everyday workloads.
The stick follows JEDEC PC4-17000 specifications and is RoHS compliant. A 2Rx8 rank layout and unbuffered architecture suit the laptop SODIMM slot without extra height from a heat spreader. Installation is a straightforward DIY step inside the HP 260 G2 chassis.
At 1.2V the module draws minimal power and generates little heat during normal use. No active cooling is required and silent operation is maintained inside the compact HP 260 G2 enclosure. The low voltage also helps preserve battery life in mobile scenarios.
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| Product | |
|---|---|
| Brand name | OWC |
| Part number | 2S1D42R816 GB |
| Total capacity | 16 GB |
| Product type | 260-Pin DDR4 Non-ECC SODIMM |
| Performance | |
| Rated speed | DDR4 2133 (PC4 17000) |
| Memory | |
| CAS latency | CL15 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 2Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.2 V |
| Compatibility | |
| Compatible systems | HP 260 G2 |
Other versions of this model
It operates at 2133 MHz with CL15 timing, matching the PC4-17000 JEDEC standard for the HP 260 G2.
Yes, the 260-pin DDR4 SODIMM form factor matches the HP 260 G2 slot exactly and has no heat spreader to clear.
No, the module is JEDEC-compliant so the HP 260 G2 detects 2133 MHz CL15 automatically; just seat it firmly until the clips click.
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