OWC 2GB DDR3 1066 PC3-8500 CL7 1Rx8 204-pin 1.5V Non-ECC SODIMM for HP Pavilion dv6 Series memory upgrade
- 2 GB
- DDR3 1066
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2GB DDR3 1333 PC3-10600 CL9 204-pin SODIMM upgrade for HP TouchSmart 9100
This OWC module is a 2 GB DDR3 SODIMM built to JEDEC PC3-10600 standards. It runs at 1333 MHz with CL9 latency and 1.5 V unbuffered operation. The single 1Rx8 rank fits the 204-pin slot used by the HP TouchSmart 9100 all-in-one system.
Builders who need a higher single-module capacity, faster DDR3 speeds or ECC error correction should look at something else. The fixed 2 GB density and non-ECC design limit use to basic desktop workloads on this specific platform.
Matching this exact speed, voltage and pin count is the single requirement for compatibility. A module with a different data rate, CAS latency or form factor will not function in the TouchSmart 9100 memory slot.
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| Product | |
|---|---|
| Brand name | OWC |
| Part number | 1S3D31R802 GB |
| Total capacity | 2 GB |
| Product type | 204-Pin DDR3 Non-ECC SODIMM |
| Performance | |
| Rated speed | DDR3 1333 (PC3 10600) |
| Memory | |
| CAS latency | CL9 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 1Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.5 V |
| Compatibility | |
| Compatible systems | HP TouchSmart 9100 |
Other versions of this model
The DDR3 SODIMM itself has no moving parts and requires no maintenance; the slot on the HP TouchSmart 9100 motherboard is designed to last the life of the system.
The CAS latency of CL9 at 1333 MHz sets the timing ceiling; the JEDEC-standard 1.5 V supply and unbuffered design keep signal integrity within spec under sustained load.
At 1.5 V the module draws only a few watts and has no heat spreader, so it adds minimal heat to the TouchSmart 9100 chassis during extended use.
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