Crucial CT2K8G3S160BM 16GB (2 x 8GB) DDR3 1600 SO-DIMM memory upgrade
- 16 GB (2 × 8 GB)
- DDR3 1600
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32 GB DDR3 1866 server memory with ECC Chipkill, load-reduced design and CL13 latency
This 32 GB Samsung module operates at DDR3 1866 with a CAS latency of CL13 and a voltage of 1.50 V. It is built for server platforms that require registered DIMMs. The load-reduced design reduces electrical load on the memory bus.
On-board ECC Chipkill corrects multi-bit errors to protect data integrity in critical workloads. The integrated heat spreader helps maintain stable temperatures during sustained operation. The module uses a 4Rx4 organisation with major brand chipset components.
The DDR3 1866 standard caps transfer rates at PC3 14900 bandwidth. Systems limited to lower DDR3 speeds will clock this module down automatically. Platforms that do not support load-reduced or ECC Chipkill registered DIMMs cannot use this memory.
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| Product | |
|---|---|
| Brand name | SAMSUNG |
| Model name | M386B4G70DM0-CMA |
| Total capacity | 32 GB |
| Performance | |
| Rated speed | DDR3 1866 (PC3 14900) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | CL13 |
| ECC support | Chipkill |
| Buffer type | Load Reduced |
| Memory rank | 4Rx4 |
| Heat spreader | Yes |
| Power | |
| Rated voltage | 1.5 V |
| Size & build | |
| Shipping weight | 0.09 kg |
| Package size | 140 × 51 × 13 mm |
No firmware updates are required for this DDR3 1866 module; the 32 GB stick is built with a heat spreader and Major Brand Chipset components for long-term server operation.
The thermal ceiling of the 4Rx4 load-reduced design is reached before signal timing margins, so sustained throughput is capped by the module's ability to dissipate heat through its spreader.
The module draws 1.50 V with a heat spreader but has no moving parts, so it adds only passive thermal load and zero acoustic noise to the chassis airflow.
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