Cooler Master Hyper 212 Halo Black CPU Cooler RR-S4KK-20PA-R1
- 120 mm
- Black
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Low-profile 45mm heatsink with a quiet 92mm fan for Intel LGA1700 CPUs
The NT09-1700 is a 45mm tall air cooler built for Intel LGA1700 processors in space-limited chassis. Its extruded aluminum fins and custom 92mm fan provide heat dissipation while keeping acoustic output low. A reinforced back plate improves contact pressure and reduces motherboard flex during installation. It suits builders assembling compact desktops or small-form-factor workstations.
Under continuous load the aluminium fin stack absorbs heat steadily while the 92mm fan maintains airflow without ramping to high speed. The low 45mm profile limits total fin surface area, so thermal capacity is lower than taller tower designs during extended heavy workloads. The reinforced back plate keeps the cold plate seated evenly, preventing contact degradation as the board warms. Expect stable temperatures for typical productivity tasks rather than prolonged maximum-turbo scenarios.
The cooler fits only Intel LGA1700 sockets and cannot be mounted on other platforms without a separate kit. At 45mm height it clears most low-profile cases, but the 92mm fan diameter still requires adequate clearance above the motherboard. Memory modules with tall heat-spreaders may interfere with the fan frame depending on slot layout. Buyers needing support for other sockets or higher thermal headroom should consider larger alternatives.
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| Product | |
|---|---|
| Product type | Accessories |
| Size & build | |
| Shipping weight | 2.27 kg |
| Package size | 25 × 25 × 25 mm |
The custom quiet 92mm fan is designed for low noise while delivering excellent cooling, and the 45mm extruded aluminum fin stack dissipates heat efficiently for all-day use.
It mounts directly to Intel LGA 1700 sockets using the included reinforced back plate, so a compatible LGA 1700 motherboard is the only prerequisite.
The slim 45mm profile and reinforced back plate keep the cooler close to the CPU, reducing motherboard flex and leaving ample clearance for taller memory modules and VRM coolers.
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