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Spool of 0.8 mm rosin-core solder wire, 50 g net weight

Solder Wire 0.8mm 50g

SKU CH-96A2-H3HE6

Lead-free rosin-core solder wire, 0.8 mm diameter and 50 g net weight, melts quickly for electronic and phone repairs

  • Fit and compatibilityOut-Opening, Narrow Stile, Store Front Doors
  • Lead-free rosin core avoids irritating fumes during soldering
  • High-purity wire resists oxidation for reliable joints
  • Low melting point speeds up electronic repair work
  • 8 mm diameter suits precision component and phone repairs
  • 50 g reel provides ample length for multiple jobs

Solder Wire 0.8 mm 50 g

This lead-free rosin-core solder wire is suited for electronics repair, phone board work and general electrical soldering. The 0.8 mm diameter provides fine control for small joints and surface-mount components.

Before Ordering Check

Verify that your soldering iron reaches a temperature suitable for lead-free alloys and that the tip size matches the 0.8 mm wire for efficient heat transfer. Ensure your workspace has adequate ventilation despite the low-odour flux.

Build and Daily Use

The spool delivers 50 g of high-purity wire with anti-oxidation properties for consistent flow and low melting point. The rosin core eliminates the need for separate flux application during routine component repairs and prototyping.

How it compares

Measured against everything we stock in Soldering Irons & Stations, at today’s prices. Recalculated every night.

Price $13.99
Cheaper than about 77% of the 802 comparable items (median $25.99).

Specifications

Compatibility
Fit and compatibilityOut-Opening, Narrow Stile, Store Front Doors

Questions about this item

What is included in the package and do I need to buy flux separately?

The package contains one spool of lead-free rosin-core solder wire, 0.8 mm diameter and 50 g net weight. The rosin core provides flux, so separate flux is not required.

Should I choose the 0.8 mm diameter or a different thickness for phone board repairs?

The 0.8 mm diameter suits fine-pitch work such as phone board repairs; thicker wire would be harder to control on small joints.

How does the low melting point affect soldering time on a dense PCB?

The low melting point lets the solder flow quickly, reducing the time the iron contacts the board and lowering the risk of heat damage.

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