Antec C5 ARGB Mid-Tower ATX PC Case
- Steel + Plastic + G…
- ATX (Back Connect)…
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An ultra-compact fanless ITX case built from thick aluminium with a 21 mm heat sink, dissipating 45 W for APU-based systems
The Streacom DB1 is an ultra-compact fanless ITX chassis built from 4 mm aluminium panels and a 21 mm extruded heat sink. It handles up to 45 W of passive cooling, making it suited for power-efficient APU or IGPU systems. CNC-milled construction with sandblasted anodised finish keeps the design clean and rigid.
The case uses solid aluminium rods that thread through the panels, so installation is a matter of aligning components and tightening screws. No fans or liquid loops are involved, removing cable routing and vibration concerns. The tight internal volume means tall CPU coolers, long GPUs or extra drives will not fit, so plan a minimal parts list.
Verify your chosen APU or IGPU stays at or below the 45 W passive limit, otherwise temperatures will rise. Confirm the ITX motherboard has no components that protrude into the heat-sink contact area. Builders needing discrete graphics, multiple storage bays or high-wattage CPUs should look elsewhere.
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| Product | |
|---|---|
| Product type | ATX / Micro ATX Mid Tower |
Monitor CPU temperatures under load; the aluminium chassis and 21 mm heat sink are rated for 45 W so thermals should stay within the processor’s specified limits.
The case includes the aluminium panels, extruded heat sink and mounting rods; you will need to supply an ITX motherboard, APU/IGPU, memory, storage and power supply.
The single DB1 model is engineered for up to 45 W cooling, making it the appropriate choice for power-efficient APU or IGPU systems.
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