Rosewill RASA-11001 RSV-Cage 4 x 3.5" HDD add-on module server accessory
- Rackmount
- HDD tray: 4 × 3.5 i…
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Adds TCG 2.0 compliant hardware security with SHA-1 and SHA-256 acceleration to Intel Xeon E5/E7 and AMD EPYC 7000 Series platforms
The Supermicro AOM-TPM-9665V-S is a discrete Trusted Platform Module designed for server motherboards supporting Intel Xeon E5/E7 and AMD EPYC 7000 Series processors. It adds a hardware root of trust that measures boot integrity and safeguards cryptographic keys. System builders integrating this module gain TCG 2.0 compliance for enterprise security requirements.
The module mounts directly on a compatible motherboard header and draws minimal power from the platform. Its microcontroller is fabricated in 0.22/0.09 um CMOS technology and operates silently without fans or heatsinks. Over-voltage and under-voltage detection plus low-frequency sensors protect the device during power anomalies.
This accessory provides a hardware accelerator for SHA-1 and SHA-256, a true random number generator, and EEPROM storage for firmware and user keys. It is intended for administrators who need measured boot, disk encryption support, or remote attestation. Buyers whose boards lack a dedicated TPM header or who require a different specification version cannot use this part.
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| Product | |
|---|---|
| Brand name | SUPERMICRO |
| Model name | AOM-TPM-9665 V-S |
| Product type | Security Module |
| Size & build | |
| Shipping weight | 0.09 kg |
| Package size | 229 × 159 × 51 mm |
The module plugs into the dedicated TPM header on supported Supermicro boards; the keyed pin-1 corner must match the header mark, or the module will not seat and the system will not detect it.
No scheduled maintenance is required; the sealed EEPROM stores firmware and keys without a battery, so replacement occurs only if the motherboard is upgraded to a platform outside the Intel Xeon E5/E7 or AMD EPYC 7000 Series support list.
The SHA-1 and SHA-256 hardware accelerator processes requests sequentially, so sustained high-volume signing or sealing operations will queue at the accelerator throughput before any thermal or voltage threshold is reached.
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