Aqua Plumb MPA1 Self Lighting Map/Pro Torch Auto Igniter Soldering
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Three-in-one kit supplies no-clean flux paste, Sn99/Ag0.3/Cu0.7 solder paste melting at 217°C, and 10 ft of 2.5 mm copper desoldering wick for electronic repair
The TH-338 kit bundles no-clean flux paste, Sn99/Ag0.3/Cu0.7 lead-free solder paste and 10 ft of 2.5 mm desoldering wick. It suits technicians and hobbyists who need all three consumables for PCB rework, BGA repair or general soldering tasks. The flux removes oxide layers without leaving residue, while the paste melts at 217°C (423°F) for reliable joints.
Verify that your components and boards tolerate a 217°C peak temperature during reflow. Confirm the 2.5 mm wick width fits the pads and through-holes you intend to desolder. Ensure your workflow accepts a rosin-based, no-clean flux that leaves minimal residue and meets RoHS requirements. The kit is not for buyers who need a different alloy composition, a lower melting point or a wider braid.
The solder paste reaches a stable 217°C melting point with smooth flow and low solder-ball tendency. Flux paste produces low smoke and a non-irritating odor during use. Desoldering wick features anti-static copper braid with high-temperature resistance for fast, clean solder removal. No power supply, fan or active cooling is involved, so acoustic noise and electrical draw are negligible.
Measured against everything we stock in Soldering Irons & Stations, at today’s prices. Recalculated every night.
| Compatibility | |
|---|---|
| Fit and compatibility | Out-Opening, Narrow Stile, Store Front Doors |
The kit contains one pack of no-clean flux paste, one pack of Sn99/Ag.3/Cu.7 solder paste and one 10 ft roll of 2.5 mm desoldering wick, so nothing extra is required.
The supplied paste uses a Sn99/Ag.3/Cu.7 alloy with a 217 °C (423 °F) melting point and 11.2 % flux, formulated for lead-free reflow on PCB, BGA, SMT and SMD tasks.
You must heat the joint to at least 217 °C (423 °F) for the Sn99/Ag.3/Cu.7 solder to flow and form a bright, smooth joint; the high-activity flux removes oxides at that temperature.
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