Thermal Grizzly Hydronaut TG-H-015-R thermal paste 1.0g
- 1.0g
- 11.8 W/Mk
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High-performance thermal paste with 11.8 W/mK conductivity for CPU, GPU and console cooling
Weight 26 g
Hydronaut is a high-performance thermal compound built for enthusiasts using substantial air or water cooling setups. Its 11.8 W/mK conductivity supports overclocking headroom while remaining non-conductive and silicone-free. The paste suits CPUs, GPUs, consoles and laptops alike.
Rated from -200 °C to +350 °C, the compound does not harden or cure over time, preserving long-term contact between die and cold plate. Electrical conductivity is 0 pS/m, eliminating short-circuit risk on exposed components. Thermal resistance measures 0.0076 K/W for efficient heat flow.
The included 10 ml syringe dispenses the 26 g payload directly onto heatspreaders, LEDs or heat-dissipating fins without waste. Viscosity of 140-190 Pas keeps the grease in place during mounting. No separate hardener or curing step is required.
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| Product | |
|---|---|
| Brand name | Thermal Grizzly |
| Product line | Hydronaut |
| Model name | TG-H-100-R |
| Part number | TG-H-100-R |
| Performance | |
| Thermal conductivity | 11.8 W/Mk |
| Size & build | |
| Net content | 1.0g |
Other versions of this model
Dispense a small dot or thin line onto the centre of the CPU or GPU die, then mount the cooler straight down so pressure spreads the paste evenly without lifting the heatsink again.
The silicone-free Hydronaut formula does not cure or harden, so it maintains its consistency and thermal performance indefinitely under normal operating temperatures.
Hydronaut is rated for continuous operation up to 350 °C, far above any component temperature reached in air or water-cooled systems.
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