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I/O module provides two analog thermocouple inputs with cold-junction compensation and IP67 protection
The Turck BL67-2AI-TC 6827178 is an I/O module that provides two analog inputs for thermocouple types B, E, J, K, N, R, S and T. It suits automation engineers who need reliable temperature acquisition across fieldbus networks such as CANopen, DeviceNet, EtherNet/IP, Modbus TCP, PROFIBUS-DP and PROFINET. Galvanic separation via optocouplers protects the electronics from field-level disturbances. The IP67 housing allows direct machine mounting without a separate enclosure.
Rated IP67, the module resists dust and water ingress while operating across a -40 °C to 70 °C ambient range. Cold-junction compensation uses a Pt1000 probe in a dedicated connector to maintain measurement accuracy. Status and diagnostic LEDs give immediate visual feedback on channel health and communication state. The compact 55 g unit connects via M12 signal interfaces for quick installation.
Galvanic isolation prevents ground loops during long-term operation, keeping temperature readings consistent over extended shifts. The optocoupler barrier protects internal circuitry from sustained electrical noise on the field side. Cold-junction compensation remains effective without drift, supporting reliable thermocouple conversion throughout production cycles. The module maintains fieldbus communication integrity under constant data exchange.
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| Product | |
|---|---|
| Brand name | TURCK |
| Model name | BL67-2AI-TC 6827178 |
| Product type | Test Equipment |
| In the box | |
| Number of items | 1 pack |
Snap the module onto a BL67 base rail, then plug the special M12 connector that contains the Pt1000 cold-junction probe; the probe must sit in that connector for accurate temperature reference.
The Pt1000 cold-junction probe inside the M12 connector can drift over time and should be recalibrated or swapped if temperature readings shift.
The unit is rated for continuous use up to 70 °C; sustained exposure above that temperature will cause it to exceed its specified thermal envelope.
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