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Small square CPLD chip FBGA-324 matte dark surface

YINGHUA

YINGHUA 5M2210ZF324I5N CPLD semiconductor FBGA-324

SKU CH-B9DJ-FCEH7

Complex programmable logic device in a 324-ball FBGA package with 2210 logic elements

  • Product typeICs Semicoductors
  • 324-pin FBGA package enables dense board integration
  • 2210 logic elements provide flexible programmable logic
  • CPLD architecture delivers instant-on non-volatile operation
  • New condition ensures reliable long-term performance

CPLD for custom logic design

The YINGHUA 5M2210ZF324I5N is a complex programmable logic device supplied in an FBGA-324 package. It targets engineers building custom digital functions for embedded or industrial systems. The 2210 logic elements provide density for medium-scale integration tasks. This component suits new designs that need field-programmable flexibility without a full FPGA footprint.

Passive thermal profile in typical operation

As a bare semiconductor die in a ball-grid array, the device has no active cooling and produces no acoustic noise. Power draw varies with configured logic density, switching frequency and I/O loading rather than a fixed figure. Thermal management depends entirely on the PCB layout, copper pour and any external heatsink the designer adds. Operation stays within commercial temperature range when the board dissipates heat adequately.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $562.99
Pricier than about 91% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How do I solder the FBGA-324 package onto my PCB without bridging pins?

Use a reflow oven with a lead-free profile; apply solder paste through a laser-cut stencil matching the 324-ball grid, then inspect with X-ray to catch hidden bridges before power-up.

When will the 5M2210ZF324I5N need replacement in a 24/7 industrial controller?

The CPLD itself has no wear-out mechanism; plan replacement only if the board suffers over-voltage damage or the design migrates to a larger logic density.

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