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Square black FBGA-900 FPGA chip with grid of solder balls

YINGHUA

YINGHUA XC6SLX150-2FGG900C FPGA semiconductor

SKU CH-4JA7-04HXK

Field-programmable gate array with 150K logic cells in a 900-ball FBGA package for custom logic designs

  • Product typeICs Semicoductors
  • High-density logic with 150k system gates
  • 900-ball FBGA package for compact board integration
  • Spartan-6 architecture enables flexible digital design
  • Industrial-grade FPGA for reconfigurable hardware acceleration

XC6SLX150-2FGG900C FPGA for custom logic design

The XC6SLX150-2FGG900C is a field-programmable gate array supplied in a 900-ball FBGA package. It provides 150 K logic cells for implementing custom digital circuits in hardware. Engineers and system integrators use this device for prototyping, signal processing and flexible I/O control in embedded applications. The component is offered in new condition.

900-ball FBGA package defines board integration

The 900-ball fine-pitch ball grid array determines the PCB footprint, routing density and assembly requirements for this FPGA. Designs that cannot accommodate this specific package outline or ball pitch will need a different device. Buyers who need a smaller package or a different pin count should select an alternative part.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $563.99
Pricier than about 91% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What does the 150 in XC6SLX150 indicate for actual logic capacity?

The 150 denotes approximately 150 thousand logic cells available for custom digital designs implemented in the fabric.

What does the 900 in FBGA-900 tell me about board integration?

The 900 refers to the 900-ball fine-pitch BGA footprint that the device uses for PCB mounting and I/O connections.

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