YINGHUA AM3352BZCZD60 Microprocessor PBGA 324
AM3352BZCZD60 microprocessor in a 324-ball PBGA package operating at 60 MHz
- Product typeICs Semicoductors
- 60 MHz core speed for responsive processing
- 324-ball PBGA package enables dense board integration
- AM3352 architecture supports embedded applications
- 3352 model delivers industrial-grade reliability
AM3352BZCZD60 Microprocessor for Embedded Designs
The AM3352BZCZD60 is a microprocessor unit supplied in a PBGA 324 package. It serves engineers developing embedded systems that require this specific part number. The component is stocked in new condition for immediate integration into board-level designs.
PBGA 324 Package for Surface-Mount Assembly
The 324-ball plastic ball grid array demands precise reflow soldering and matching PCB land patterns. This packaging suits automated assembly lines and dense circuit layouts where through-hole mounting is not an option. Handle with standard ESD precautions during placement.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $141.99
- Pricier than about 83% of the 1,027 comparable items (median $34.99).
Specifications
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|---|---|
| Product type | ICs Semicoductors |
Questions about this item
What does the 60 in the AM3352BZCZD60 part number indicate?
The 60 is a suffix in the ordering code for this AM3352 device.
What board footprint does the PBGA-324 package require?
The PBGA-324 package uses a 324-ball grid array footprint for surface-mount soldering.
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