We take cryptocurrency — so the coins you hold can buy real hardware.Pay in crypto, spend it on real hardware. Free insured shipping worldwide over $399. Plain, unbranded boxes, sent from Germany.Free insured shipping over $399. Your rate is locked for 30 minutes once checkout opens.Rate locked 30 minutes. Every item sealed, serial-checked and covered by a 24-month warranty.Sealed, 24-month warranty.

Saved items Sign in
Small square BGA-400 semiconductor chip with grid of solder balls

YINGHUA

YINGHUA XC7Z010-2CLG400C BGA-400 semiconductor

SKU CH-JHZ0-K4MTF

A new semiconductor IC in a 400-ball BGA package for electronic assemblies

  • Product typeICs Semicoductors
  • BGA-400 package provides dense board-level integration
  • Dual-core processing handles parallel workloads efficiently
  • 2 speed grade meets timing-critical designs
  • Industrial temperature range suits harsh environments
  • New condition ensures full manufacturer specifications

YINGHUA XC7Z010-2CLG400C BGA-400 semiconductor

The YINGHUA XC7Z010-2CLG400C is a new semiconductor device in BGA-400 packaging. It serves engineers and developers building embedded processing systems. The component integrates programmable logic with processor cores for custom hardware acceleration. This part suits new designs requiring flexible I/O and real-time control.

Capacity and headroom for embedded designs

The BGA-400 package provides 400 connections for extensive peripheral interfacing. Logic resources handle moderate digital signal processing and custom protocol implementation. Complex multi-core software workloads may exceed available processing cycles. Large external memory buffers require careful partition planning across the fabric.

BGA-400 package defines board integration

The 400-ball grid array dictates PCB footprint, layer count and escape routing strategy. Assembly requires controlled reflow profiles for reliable solder joints. Signal integrity depends on matched trace lengths across the dense ball pattern. Designers must verify thermal dissipation paths match the mechanical enclosure.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $143.99
Pricier than about 83% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

Will the XC7Z010-2CLG400C BGA-400 fit on a board designed for the earlier 400-ball Zynq packages?

The device uses a 400-ball BGA footprint; pin compatibility depends on your specific board layout and the exact Zynq part it was designed for.

How can I verify the XC7Z010-2CLG400C is functioning after soldering it to my PCB?

Apply power, confirm the done pin goes high, then use JTAG to read the device IDCODE and run a simple PL configuration test.

Does the XC7Z010-2CLG400C BGA-400 tray include a heatsink or programming cable?

The part ships as a bare 400-ball BGA IC; thermal solution and JTAG programmer must be sourced separately.

More in Encoders & Semiconductor Parts

Similar items