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Square black FBGA-1136 package with 1136 solder balls in a grid

YINGHUA

YINGHUA XC5VLX110T-2FF1136I FPGA semiconductor

SKU CH-2BVR-V7W5F

FPGA with 110 logic cells in FBGA-1136 package for programmable logic applications

  • Product typeICs Semicoductors
  • 110K logic cells enable complex designs
  • 1136-ball FBGA package supports high-density boards
  • Field-programmable architecture allows post-production updates
  • Industrial temperature rating suits harsh environments

XC5VLX110T-2FF1136I FPGA for custom logic

The XC5VLX110T-2FF1136I is a field-programmable gate array built for engineers who need reconfigurable logic in a high-density package. It suits prototyping, signal processing and custom accelerator designs where the logic fabric must be tailored after deployment. The FBGA-1136 package provides 1136 balls for extensive I/O connectivity. This device is not for buyers who want a fixed-function ASIC or a microprocessor with a defined instruction set.

FBGA-1136 package limits board layout

The 1136-ball fine-pitch ball grid array demands precise PCB design with controlled-impedance routing and adequate layer count for signal integrity. High pin density restricts breakout options and may require advanced via structures that increase fabrication cost. Designers without access to high-density layout tools or assembly lines capable of fine-pitch BGA soldering should evaluate alternative package styles. The 110 logic-cell count defines the maximum design capacity available in this specific part.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $274.99
Pricier than about 90% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

Should I choose the 110 logic-cell version or a different capacity?

The part number XC5VLX110T-2FF1136I specifies a single 110 logic-cell capacity; no alternative capacities exist for this MPN.

What does the 1136 FBGA package mean when the device is soldered to a board?

The 1136-ball FBGA package provides 1136 solder balls for high-density PCB mounting and extensive I/O connectivity.

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