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Small square black chip with grid of solder balls underneath

YINGHUA

YINGHUA XC6SLX25T-3CSG324I FPGA-Field Programmable Array CSBGA-324 semiconductor

SKU CH-W4C2-8RR92

A 25 K logic cell FPGA in a 324-ball CSBGA package for custom digital designs

  • Product typeICs Semicoductors
  • Spartan-6 FPGA with 25k logic cells for flexible digital design
  • 324-ball CSBGA package enables compact PCB integration
  • Industrial temperature rating suits demanding operating environments
  • New condition ensures full manufacturer specifications and reliability

Spartan-6 FPGA for embedded logic

The XC6SLX25T-3CSG324I is a Xilinx Spartan-6 field-programmable gate array supplied in a 324-ball chip-scale BGA package. It provides 25K logic cells for custom digital designs in industrial and communications equipment. The device operates at industrial temperature grades for rugged environments.

324-ball CSBGA footprint dictates board layout

This package has 324 solder balls on a fine-pitch grid that requires precise PCB land patterns and controlled-impedance routing. Designs needing a different ball count or a larger logic density cannot use this part. Boards must accommodate the specific CSBGA mechanical outline.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $568.99
Pricier than about 91% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What does the 25 in XC6SLX25T indicate for my design?

The 25 identifies the device density tier in the Spartan-6 family, representing the relative logic capacity of this FPGA.

What does the CSBGA324 package mean for board layout?

CSBGA324 is a 324-ball chip-scale BGA, giving a compact footprint with ball pitches suited to dense PCB routing.

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